By Charles Pfeil
This e-book is for PCB designers who're designing forums with a number of very huge Ball Grid Array (BGA) applications. It explores the influence of dense BGAs with excessive pin-count on PCB layout and offers recommendations for the inherent layout demanding situations. although you'll no longer but were faced with the problems of routing BGAs and the influence on fabrication expenses and sign integrity, this publication will show those capability pitfalls in addition to easy methods to mitigate those difficulties
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Extra info for BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs
A good example of these adjustments is impedance control. Regardless of how carefully the stackup is defined with trace widths, material choices, dielectric and copper thicknesses, the fabrication process is not so exact. Each vendor has different equipment and methods. The lamination process shrinks the dielectrics and materials may be changed if not in stock or readily available. The tolerances in all areas add up and ultimately a reliable vendor has to make the right combination of adjustments in-process so that when measuring impedance on the test coupon, it fulfills your spec.
A stripline configuration, where pairs of signal layers are sandwiched between plane layers, not only provides the best return paths but also reduce crosstalk. This supports the notion that using a ground plane on the outer layers is a good practice. Recommended HDI Stackups What are the best HDI stackups for BGA breakouts and routing? It depends on your priorities. The following stackups were analyzed for relative cost, route density, power integrity and signal integrity. The three are rated at the top with the priority given to route density with good power and signal integrity.
It depends on your priorities. The following stackups were analyzed for relative cost, route density, power integrity and signal integrity. The three are rated at the top with the priority given to route density with good power and signal integrity. 44 Chapter Three – HDI Stackups Stackup A Figure 3-12: Stackup A Stackup A Comments: • Total score = 13 • This is a great average of the variables and a good stackup if you are starting out with HDI. • The via models are simple and it won’t be difficult to find vendors who can fabricate them.